1 files changed, 110 insertions, 0 deletions
diff --git a/hardware/kicad/t-modem-s1224/scripts/kicad10_layers_setup.sexpr b/hardware/kicad/t-modem-s1224/scripts/kicad10_layers_setup.sexpr
new file mode 100644
index 0000000..0f3f583
--- /dev/null
+++ b/hardware/kicad/t-modem-s1224/scripts/kicad10_layers_setup.sexpr
@@ -0,0 +1,110 @@
+(layers
+    (0 "F.Cu" signal)
+    (2 "B.Cu" signal)
+    (9 "F.Adhes" user "F.Adhesive")
+    (11 "B.Adhes" user "B.Adhesive")
+    (13 "F.Paste" user)
+    (15 "B.Paste" user)
+    (5 "F.SilkS" user "F.Silkscreen")
+    (7 "B.SilkS" user "B.Silkscreen")
+    (1 "F.Mask" user)
+    (3 "B.Mask" user)
+    (17 "Dwgs.User" user "User.Drawings")
+    (19 "Cmts.User" user "User.Comments")
+    (21 "Eco1.User" user "User.Eco1")
+    (23 "Eco2.User" user "User.Eco2")
+    (25 "Edge.Cuts" user)
+    (27 "Margin" user)
+    (31 "F.CrtYd" user "F.Courtyard")
+    (29 "B.CrtYd" user "B.Courtyard")
+    (35 "F.Fab" user)
+    (33 "B.Fab" user)
+  )
+(setup
+    (stackup
+      (layer "F.SilkS"
+        (type "Top Silk Screen")
+      )
+      (layer "F.Paste"
+        (type "Top Solder Paste")
+      )
+      (layer "F.Mask"
+        (type "Top Solder Mask")
+        (color "Green")
+        (thickness 0.01)
+      )
+      (layer "F.Cu"
+        (type "copper")
+        (thickness 0.035)
+      )
+      (layer "dielectric 1"
+        (type "core")
+        (thickness 1.51)
+        (material "FR4")
+        (epsilon_r 4.5)
+        (loss_tangent 0.02)
+      )
+      (layer "B.Cu"
+        (type "copper")
+        (thickness 0.035)
+      )
+      (layer "B.Mask"
+        (type "Bottom Solder Mask")
+        (color "Green")
+        (thickness 0.01)
+      )
+      (layer "B.Paste"
+        (type "Bottom Solder Paste")
+      )
+      (layer "B.SilkS"
+        (type "Bottom Silk Screen")
+      )
+      (copper_finish "None")
+      (dielectric_constraints no)
+    )
+    (pad_to_mask_clearance 0)
+    (allow_soldermask_bridges_in_footprints no)
+    (tenting front back)
+    (aux_axis_origin 100 100)
+    (grid_origin 100 100)
+    (pcbplotparams
+      (layerselection 0x00000000_00000000_00000000_000000a5)
+      (plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
+      (disableapertmacros no)
+      (usegerberextensions no)
+      (usegerberattributes yes)
+      (usegerberadvancedattributes yes)
+      (creategerberjobfile yes)
+      (dashed_line_dash_ratio 12.000000)
+      (dashed_line_gap_ratio 3.000000)
+      (svgprecision 6)
+      (plotframeref no)
+      (mode 1)
+      (useauxorigin no)
+      (hpglpennumber 1)
+      (hpglpenspeed 20)
+      (hpglpendiameter 15.000000)
+      (pdf_front_fp_property_popups yes)
+      (pdf_back_fp_property_popups yes)
+      (pdf_metadata yes)
+      (pdf_single_document no)
+      (dxfpolygonmode yes)
+      (dxfimperialunits yes)
+      (dxfusepcbnewfont yes)
+      (psnegative no)
+      (psa4output no)
+      (plot_black_and_white yes)
+      (plotinvisibletext no)
+      (sketchpadsonfab no)
+      (plotpadnumbers no)
+      (hidednponfab no)
+      (sketchdnponfab yes)
+      (crossoutdnponfab yes)
+      (subtractmaskfromsilk no)
+      (outputformat 1)
+      (mirror no)
+      (drillshape 1)
+      (scaleselection 1)
+      (outputdirectory "")
+    )
+  )